Product Features
1. Transmission reach beyond 1300 km/3000 km over SMF for 200G/100G
2. Hot-pluggable
3. Support PM-16QAM(200G) and PM-DQPSK/PM-QPSK(100G) modulation
4. Supports SD-FEC
5. Supports 100G/200G Flex-rate
6. Supports OTU4/OTUC2/2 x 100GE/100GE signaling
7. Compliant with CEI-28G-MR specifications
8. Compliant with OTL4.4/OTLC2/CAUI-4 signaling
9. Compliant with CFP2 MSA Hardware Specification Rev. 1.0
10. Compliant with OIF-CFP2-DCO-01.0
11. Compliant with CFP MSA Management Interface Specification Version 2.6 (R06a)
12. Line & client PRBS generator and checker
13. Line loopback, host terminal/facility loopback
14. Power consumption: 26 W (200G)/21 W (100G)
Application
The module is designed to be used on the host board of system integrators to support transmission over DWDM links in Metro networks. As shown in Figure 2-1, it comprises high-data lanes, a single reference clock from hosts, a single 3.3 V power supply, an MDIO interface for module control and status report, and dedicated alarm and control pins.
Ordering Information
| Part Number |
Description |
Modulation |
LACF2-DCO-200G |
100/200G DCO CFP2 50GHz ITU-T Grid
C Band-LC |
200G PM-16QAM/100G PM-DQPSK/100G PM-QPSK |
Notes:
If you need more customized services, please contact us.
Host Interface Configuration
The module supports host signal types: OTUC2/OTU4/100GE/2 x 100GE. The host electrical interfaces are compliant with CEI-28G-MR. The host rate is dependent on the framing type and the supported host rates are shown in the following table. Clock source is need for synchronization, and module REFCLK input clock = Host Baud Rate/160.
Table 1-1 Host rates
| Host Frame |
Signaling |
Data Rate (Gbps) |
REFCLK Clock |
| 200G OTUC2 |
OTLC2 NRZ |
28.076 |
175.476 MHz, ±20 ppm |
| 100G OTU4 |
OTL4.4 NRZ |
27.952 |
174.703 MHz, ±20 ppm |
| 100GE |
CAUI-4 NRZ |
25.78125 |
NA |
Line Framing Format
The line framing format is Link-all proprietary and it is required that both ends of the optical connection use Link- all technologies, in which there is proprietary SD-FEC in conjunction with 200G PM-16QAM/100G PM- DQPSK/100G PM-QPSK modulation. The actual line rate depends on the configured FEC mode and the host data format.
Table 1-2 Line modulation formats
| Line Data Rate |
Min Grid Spacing (GHz) |
Baud Rate (Gbaud) |
Modulation Format |
FEC OH |
Rx OSNR(dB) EOL @Pre- FEC BER |
| 200G |
50 |
39.7 |
PM-16QAM |
25% |
17 |
100G |
50 |
33.6 |
PM-QPSK
/PM-DQPSK |
25% |
11.5/13 |
Configuration Overview
The table below summarizes the possible combinations of host type and line side (modulation) that can be configured through the MDIO interface. Refer to the LACF2-DCO-200G software interface specification for register details needed to configure the CFP2 for the desired application.
Table 1-3 Configuration overview table
| Host Format |
Host Signaling |
Line Side Configuration |
FEC |
Line Format |
| OTUC2 |
OTLC2 |
PM-16QAM |
SD-FEC |
Link-all proprietary |
| OTU4 |
OTL4.4 |
PM-DQPSK |
SD-FEC |
Link-all proprietary |
| OTU4 |
OTL4.4 |
PM-QPSK |
SD-FEC |
Link-all proprietary |
| 2 x OTU4 |
OTL4.4 |
PM-16QAM |
SD-FEC |
Link-all proprietary |
| 2 x 100GE |
2 x CAUI-4 |
PM-16QAM |
SD-FEC |
Link-all proprietary |
| 100GE |
CAUI-4 |
PM-QPSK |
SD-FEC |
Link-all proprietary |
Environmental Specifications
The table below defines the environmental specifications of the LACF2-DCO-200G module.
Electrical Characteristics
A single +3.3 V power supply shall be provided by the host card through the 104-pin connector and internal DC/DC power converters are used to regulate the power for different components inside the module. The +3.3 V power supply provided by the host shall adhere to the CFP2 MSA Hardware Specification version1.0 available at x. The electrical ground is isolated from the module chassis ground. The power supply requirements are specified in Table 8-1 below. Those power classes for which the maximum current per pin exceeds 1125 mA will require agreement from the electrical connector supplier.
Notes:
1. Power consumption depends on the actual application condition. For 200G PM-16QAM typical application, optical links should have enough OSNR margin with pre-BER better than 1.5e-2 and power consumption is less
than 26 W (200G with framer enabled)/21 W (100G with framer enabled).
2. With framer disabled, the power consumption will be reduced to 25 W for 200G or 20 W for 100G. The LACF2-DCO-200G module supports alarm, control, and monitoring functions over an MDIO bus. This interface consists of eight pins listed in the table below.
The PRG_CNTRL [2:1] signals have MSA defined default meanings that are listed in the CFP MSA implementation agreement. The lower two bits (hardware interlock) define the power class of the module and must be kept static during initialization. When MOD_LOPWR is active, the maximum power consumption is < 2 W and the host can still communicate with the module via the MDIO interface. The MOD_RSTN signal is run to a reset chip to generate a reset to the internal MCU and oDSP ASIC (RST_N). There are five alarm pins from the module back to the host.
All signals but MOD_ABS interface to the DSP ASIC. The PRG_ALRM [2:1] signals have MSA defined default meanings that are listed in the CFP2 implementation agreement. The transmitter and receiver comply with the CEI-28G-MR electrical specification. The data lines are AC-coupled
and terminated in the module according to the following figure from the CFP2 MSA. The termination also applies to the reference clock, TX monitor clock, and RX monitor clock.
Optical Characteristics
All specifications given in this document are End-of-Life numbers and are valid over the operating temperature. The two tables below contain specifications of the general transmitter and the general receiver. Specifications are common across the Link-all Metro product family.
Mechanical Specifications
The CFP2 module is designed to be inserted into a host board with a railing system that includes a heat sink. The
module is 107.5 mm x 41.5 mm x 12.4 mm in size and is mechanically compliant with the requirements detailed
the CFP2 HW Baseline Design Rev.1L.
Notes:
Please check whether the cage matches before using the module because of the side has dissipation hole
structure. For example, the cage part CN121C-104-0029(H1) (YAMAICHI) has side openings and a side
without sharp protrusions.
The module plug connector is a sub-component within the CFP2 module. The PCB inserts into the connector with top and bottom rows of pins (primary and secondary sides of the PCB). The host connector has a physical offset of the pin contacts to ensure that certain signals make and break contacts before others. The ground mates first, the 3.3V and 3.3 V ground mate second, the control and status signals mate third, and the MOD_LOPWR, MOD_ABS and high speed data signals mate last.
The module connector is a 104-pin plug connector. The connector pinout defined by CFP2 MSA and Link-all (including debug and sub-modulation signals using VND_IO_x pins) is as follows. Customers must not connect to any of the VND_IO_x pins unless specifically allowed to do so.
Notes:
1. 100G OTU4/100GE: TX (RX) 0~3 for OTL4.4/CAUI-4 signaling.
2. 200G OTUC2/2 x 100GE: TX (RX) 0~3 for one OTLC/CAUI-4 signaling, TX (RX) 4~7 for another
OTLC/CAUI-4 signaling. The optical port connections on the front of the CFP2 module are shown in Figure 10-1. The CFP2 module will support LC receptacles for standard single-mode fiber. As mention in the OIF-CFP2-DCO-01.0, the position of the optical connector in the Y and Z axes shall be specified by the CFP2-DCO module manufacturer. In addition to the centered duplex LC connector location specified by the CFP MSA, the CFP2-DCO IA also optionally allows the optical port position on the front of the module to be either left or right-justified if needed to enable a certain vendor-specific implementation technology.
Regulatory and Reliability Specifications
Laser Safety
The module is designed to comply with Class 1 laser, according to IEC/EN 60825-1/A2: 2001, or FDA CDRH21 CFR-1040. Don't directly look into the transmitter fiber connector at any time while the module is in operation.
ESD
The module is designed to meet ESD susceptibility up to 500V according to GR-78 (Human Body Model using C = 100 pF, R = 1.5 kOhm) on the high-speed pins and 2000 V for all other pins. Handle only at Static Safe Work Stations.
Electromagnetic Emission
The module is designed to comply with Class B electromagnetic emission according to GR-1089-CORE Sections
3.2.1.1 and 3.2.1.3 .
Electromagnetic Immunity
The module is designed to comply with EMI 8.5V/m per GR.1089-CORE section 3.3.1 .
Flammability
The module is designed to comply with GR-63 section 4.2.3 for fire resistance.
RoHS
The module complies with Directive 2011/65/EC on the restriction on the use of certain hazardous substances in electrical and electronic equipment and with exception 6a, 6c, 7b and 13a permitted by Commission Decision (2010/571/EU).
Reliability
The module is designed to comply with GR-468 for general reliability. Target FIT < 2700 at 55°C operating case temperature
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